Stencil

 

Printing Process

 

80% of SMT process failure derives from printing process. Printer was gradually improved a lot in its specifications and SPI (Solder Paste Inspection) is nowadays generally popular.

 

However, don’t we shall be responsible as well on inspecting the printing processes and its failures instead of depending machine itself?

 

 

Stencil Detailed Specifications

 

Factory engineers normally request the info of Mask opening ratio and aperture to the mask supplier, but the info of processing tolerance and surface accuracy have been neglected.

 

When a new stencil is being placed, precise checking is skipped. When comes to the occurrences of printing issues, only machine parameter adjustment such as auto cleaning being carried out by local engineers instead of truly do manual checking on the actual printing condition.

 

Nowadays, laser stencil is supported by most of the factory; however, it’s still quite difficult to maintain a good printing condition without high tolerance of stencil opening surface.

 

 

 

As what we can see from the photo shown above, there are cases happen regularly; although both regular automatic cleaning and manual cleaning at every 30 minutes are taken, the printing result is still not so stable.

 

Why? The reason is people never take positive and relevant QC actions beyond the “ok” sign shown by SPI.

 

 

Analysis.

 

 

 

Thickness

Aperture Size

Taper

Original Specs

150 μm

200 μm

-

Result

140.24 μm

208.46 μm/ 221.72 μm

13.26 μm

Target

150μm ± 5 μm

200 μm ± 5 μm/

205 μm ± 5 μm

10 μm

 

From the analysis shown above, taper must be below 10 μm and its tolerance must be below 5 μm. The current opening surface accuracy is 7-10 μm.

 

 

Below 5 μm

 

To achieve higher accuracy of laser stencil, higher power of laser at the right process time and higher quality grinding will be necessary, and it will be able to offer 1-4 μm surface tolerance.

 

 

:: Quoted by Mr. Berdie, 17 Aug 2009 ::